Analog Integrated Circuit design

Analog integrated circuit design is one of the most essential and challenging work in electrical engineering. There are several specializations, including application specific integrated circuits (ASICs).  We are developing several ASICs for communication systems, computing systems, optoelectronic systems, energy harvesting systems and sensors. Some topics include:

• Active Pixel Sensors for edge applications
• Power converter and sensor circuits for IoT and BIPV systems
• DC-DC boost converters
• Voltage regulator circuits and systems
• Analog to digital converter systems
• Charge management systems
• Transceiver Design

	TRx chip
RX Chip	TX Chip

RF/mm Wave Circuits and Systems

Radio frequency refers to electromagnetic wave in the range of 3 kHz to 300 GHz, which corresponds to the frequency of radio waves. RF/mm Wave include overall research and design using high-frequency and wireless communication in radio/mm frequency bands. Applications include 5G communications, Radar, etc. Some topics include:

• RF filters
• Microwave component design
• Power amplifiers
• 60 GHz communication front-end solutions
• Network-on-chip solutions
  • Wireless chip-to-chip solutions
  • THz Transceiver solutions for chip-to-chip applications
  • High-bandwidth package (HBP) design and characterization

On-Board Short-Reach Communication Links

As electrical interconnects possess some communication bottlenecks at high frequencies due to electromagnetic interference, crosstalk and high power consumption, optical interconnect offer a solutions to for meeting with the high speed and bandwidth requirements of the next generation computing systems. A high speed and multi-channel reconfigurable optical printed circuit board (REOPCB) allows for the implementation of a hybrid OPCB for chip-to-chip (CPU to Memory) board-level communication links.

Bidirectional Communication Links

As electrical interconnects possess some communication bottlenecks at high frequencies due to electromagnetic interference, crosstalk and high power consumption, optical interconnect offer a solutions to for meeting with the high speed and bandwidth requirements of the next generation computing systems. A 40 Gb/s bidirectional optical link using four-channel optical subassembly (OSA) modules and two different wavelengths for the up- and down-link is demonstrated. The module can be used in Active Optical Cable applications for data centers.

Transceiver Design and Packaging Solutions

For successful implementation of short-reach optical communication links, there should be effectively designed transmitter (Tx), receiver (Rx) and transceiver (TRx) modules for electro-optic (EO) conversions. Also packaging solutions should be considered for better performance.

	Planar Transmitter Module